MGSBP20 /TD80 0,486 KG Cartridge, epoxy-based bonding paste
Disponible en stock
- Nº de artículo:
- WS08400014
- Compra mínima:
- 3
- Peso:
- 0.486 kg
- Fecha de caducidad:
- 15.03.2028
MGSBP20 /TD80 0,486 KG Cartridge, epoxy-based bonding paste
BP20 is a solvent-free epoxy-based bonding paste which was especially developed for fast setting bondings in composites applications and for bondings of composites and metal.
Fast curing bonding and repair of composite structures, bonding of composites and metal consisting of EPIKOTE resin MGS BPR 20 and EPIKURE curing agent MGS BPH 20.
Manufacturer: Hexion
Fast curing bonding and repair of composite structures, bonding of composites and metal consisting of EPIKOTE resin MGS BPR 20 and EPIKURE curing agent MGS BPH 20.
Manufacturer: Hexion
Accesorios
En stock
Mixing nozzle for MGSBP20 /TD80 0.486 KG cartridge (1 bag = 10 pieces)
Mixing nozzle for MGSBP20 /TD80 0.486 KG cartridge
En stock
Cartridge gun for MGSBP20 /TD80 0.486 KG cartridge
Cartridge gun for MGSBP20 /TD80 0.486 KG cartridge BE2013